Package Terminology

Packaging Information - Package Reference Guide

Packaging Information

Package Terminology

BGA
Ball Grid Array

CBGA
Ceramic Ball Grid Array


CDIP
Glass-Sealed Ceramic Dual In-Line Package

CDIP SB
Side-Braze Ceramic Dual In-Line Package

CFP
Both Formed and Unformed CFP

CPGA
Ceramic Pin Grid Array


CZIP
Ceramic Zig-Zag Package

Description
Description of package type.

DFP
Dual Flat Package

FC/CSP
Flip Chip / Chip Scale Package

HLQFP
Thermally Enhanced Low Profile QFP

HQFP
Thermally Enhanced Quad Flat Package

HSOP
Thermally Enhanced Small-Outline Package

HTQFP
Thermally Enhanced Thin Quad Flat Pack

HTSSOP
Thermally Enhanced Thin Shrink Small-Outline Package

HVQFP
Thermally Enhanced Very Thin Quad Flat Package

JEDEC
The JEDEC Standard for this package type.

JLCC
J-Leaded Ceramic or Metal Chip Carrier

LCCC
Leadless Ceramic Chip Carrier

Length
The length of the device (in millimeters).

LGA
Land Grid Array

LQFP
Low Profile Quad Flat Pack

Maximum Height
The maximum height above board surface form (in millimeters).

PDIP
Plastic Dual-In-Line Package

PFM
Plastic Flange Mount Package

Pkg
Package designator code used in Texas Instruments part numbers. The link from the Pkg code goes to the package mechanical drawing in PDF format. Each of the PDF files is between 30K and 50K Bytes.

Pins
The number of pins or terminals on the package.

Pitch
The distance between the centers of adjacent pins (in millimeters).

Preference Code
P - Use this package whenever possible
OK - Use if a preferred package is not available
A - Department approval required
X - Do not use

QFP
Quad Flat Package

SIP
Single-In-Line Package

SOJ
J-Leaded Small-Outline Package

SOP
Small-Outline Package (Japan)

SSOP
Shrink Small-Outline Package

TFP
Triple Flat Pack

TO/SOT
Cylindrical Package

TQFP
Thin Quad Flat Package

TSSOP
Thin Shrink Small-Outline Package

TVFLGA
Thin Very-Fine Land Grid Array

TVSOP
Very Thin Small-Outline Package

Thickness
The maximum thickness of the package body (in millimeters).

Type
The abbreviated acronymn for this type of package.

VQFP
Very Thin Quad Flat Package

Width
The width of the device (in millimeters).

*Additional types used in Package Designator Tables - These all are marked "DO NOT USE."

DIMM*
Dual-In-Line Memory Module

HSSOP*
Thermally Enhanced Shrink Small-Outline Package

LPCC*
Leadless Plastic Chip Carrier

MCM*
Multi-Chip Module

MQFP*
Metal Quad Flat Package

OPTO*
Light Sensor Package

PLCC*
Plastic Leaded Chip Carrier

PPGA*
Plastic Pin Grid Array

SDIP*
Shrink Dual-In-Line Package

SIMM*
Single-In-Line Memory Module

SODIMM*
Small Outline Dual-In-Line Memory Module

TSOP*
Thin Small-Outline Package

VSOP*
Very Small Outline Package

XCEPT*
Exceptions - May not be a real Package

Note: In the event of a conflict in dimensions this selection guide and the mechanical drawing, the mechanical drawing shall govern.